PCB/FPC Laser Machine

FPC Precision Laser Depaneling Machine Series: MS0404-V-B

FPC Precision Laser Depaneling Machine Series: MS0404-V-B

Introduction

The precision laser cutting machine (laser depaneling machine) adopts non-contact processing, will not produce any mechanical deformation and can be processed arbitrarily complex graphics, shorten delivery time. High performance CCD enable auto-location, auto-correction and suitable for high precision processing, cutting thermal effect, improving the yield rate; cutting without burrs and black edges, no secondary processing, suitable for FPC reinforcement board, PCB rigid board, PI, LCP and other materials laser cutting film.

Inquiry

Sample

Camera module cutting
Circuit board cutting
PI film cutting
FPC cutting
Parameter

Parameter

  • Modle
    MS0404-V-B
  • Laser power(W)
    UV Laser:10~20W Green laser:30W
  • Working area (mm)
    400X400
  • Spot size
    <20μm
  • Accuracy
    ±20μm
  • Dimension (mm)
    1300 X 1100 X 1750
  • Weight(Kg)
    1200
  • Supply voltage
    AC220V±10%
    50/60Hz
  • Working environment
    Temp: 15~30°C,humidity: 5~85%, no condensation, no dust.
  • Gross Power (kw)
    5.5

Feature

  • Professional laser cutting software for PCB industry, and easy for operation;The MES system customization and seamless docking of the production line can be realized;
  • Imported laser source and optic system to ensure machine long term stable performance;
  • CCD module helps to achieve auto-positioning cutting;
  • Optional with linear motor and marble platform to achieve high precision requirement;
  • Multiple platforms more functions, honeycomb adsorption platform is standard;
  • PCB board transmission track is optional, and prefect match SMT assembly line;
  • FPC,PCB processing platform and is optional for laser depaneling machine

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