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Han's Yueming Laser Group will take part in MEDICA, the world-leading trade fair for medical technology, held in Düsseldorf, Germany, from 16 to 19 November.
At Booth 71D412, Han's Yueming will present the DM300 high-precision laser decapsulation solution. It is designed for laser decapsulation, cutting and thinning of chips, capacitors, resistors and other electronic components. Featuring non-contact laser processing, the DM300 eliminates mechanical stress during processing and supports stable, repeatable failure analysis for medical-grade electronic components.
Our technical team is ready for face-to-face discussions with visitors. We provide custom laser processing solutions tailored to your unique production, testing and failure analysis requirements.
Come and see the DM300 live at our booth, and discover how precision laser technology unlocks new possibilities for medical semiconductor manufacturing and future healthcare innovation.
We sincerely look forward to welcoming you in Düsseldorf.

